LeoGue
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Ciao a tutti,
Ho da poco aggiornato il BIOS della scheda madre all'ultima versione 5021, resettando il BIOS e settando solamente la frequenza della memoria RAM corretta (3600Mhz) riscontro che i timings della RAM siano molto più elevati di quel che dovrebbero essere.
Timings desiderati
Trident Z Neo
DDR4-3600 CL16-19-19-39 1.35V
16GB (2x8GB)
Timing rilevati: Vedi sotto.
Componenti PC:
AMD 3700x
TUF GAMING X570-PLUS (WI-FI) - Bios 5021
2x F4-3600C16D-16GTZNC (32Gb tot.)
RTX 3070 ti
Nome SO Microsoft Windows 10 Pro
Versione 10.0.19042 build 19042
Dove potrebbe essere l'errore o il settaggio errato nel BIOS?
RAMMON:
Grazie mille,
Saluti
Ho da poco aggiornato il BIOS della scheda madre all'ultima versione 5021, resettando il BIOS e settando solamente la frequenza della memoria RAM corretta (3600Mhz) riscontro che i timings della RAM siano molto più elevati di quel che dovrebbero essere.
Timings desiderati
Trident Z Neo
DDR4-3600 CL16-19-19-39 1.35V
16GB (2x8GB)
Timing rilevati: Vedi sotto.
Componenti PC:
AMD 3700x
TUF GAMING X570-PLUS (WI-FI) - Bios 5021
2x F4-3600C16D-16GTZNC (32Gb tot.)
RTX 3070 ti
Nome SO Microsoft Windows 10 Pro
Versione 10.0.19042 build 19042
Dove potrebbe essere l'errore o il settaggio errato nel BIOS?
RAMMON:
Codice:
RAMMon v3.1 Build: 1000 built with SysInfo v3.0 Build: 1000
PassMark (R) Software
www.passmark.com
============================
Memory settings
============================
Transfer rate: 3600 MT/s
Memory timings: 25-25-25-58
Channel mode: 1
============================
Memory capacity / benchmarks
============================
L1 cache: 64 KB (225.1 GB/s)
L2 cache: 512 KB (93.0 GB/s)
L3 cache: 32768 KB (20.1 GB/s)
Physical RAM: 31.9 GB (16937 MB/s)
Latency: 37.173 ns
============================
Memory SPD information
============================
Item | Slot #1 | Slot #2 | Slot #3 | Slot #4 |
--------------------------------------------------------------------------------------|----------------------------------------|----------------------------------------|----------------------------------------|----------------------------------------|-
Ram Type | DDR4 | DDR4 | DDR4 | DDR4 |
Maximum Clock Speed (MHz) | 1802 (XMP) | 1802 (XMP) | 1802 (XMP) | 1802 (XMP) |
Maximum Transfer Speed (MT/s) | DDR4-3603 | DDR4-3603 | DDR4-3603 | DDR4-3603 |
Maximum Bandwidth (MB/s) | PC4-28800 | PC4-28800 | PC4-28800 | PC4-28800 |
Memory Capacity (MB) | 8192 | 8192 | 8192 | 8192 |
DIMM Temperature | 37.250 | 35.250 | 35.750 | 36.250 |
Jedec Manufacture Name | G Skill Intl | G Skill Intl | G Skill Intl | G Skill Intl |
Search Amazon.com | Search! | Search! | Search! | Search! |
SPD Revision | 1.1 | 1.1 | 1.1 | 1.1 |
Registered | No | No | No | No |
ECC | No | No | No | No |
On-Die ECC | No | No | No | No |
DIMM Slot # | 1 | 2 | 3 | 4 |
Manufactured | | | | |
Module Part # | F4-3600C16-8GTZNC | F4-3600C16-8GTZNC | F4-3600C16-8GTZNC | F4-3600C16-8GTZNC |
Module Revision | 0x0 | 0x0 | 0x0 | 0x0 |
Module Serial # | 0x0 | 0x0 | 0x0 | 0x0 |
Module Manufacturing Location | 0 | 0 | 0 | 0 |
# of Row Addressing Bits | 16 | 16 | 16 | 16 |
# of Column Addressing Bits | 10 | 10 | 10 | 10 |
# of Banks | 16 | 16 | 16 | 16 |
# of Ranks | 1 | 1 | 1 | 1 |
Device Width in Bits | 8 | 8 | 8 | 8 |
Bus Width in Bits | 64 | 64 | 64 | 64 |
Module Voltage | 1.2V | 1.2V | 1.2V | 1.2V |
CAS Latencies Supported | 10 11 12 13 14 15 16 | 10 11 12 13 14 15 16 | 10 11 12 13 14 15 16 | 10 11 12 13 14 15 16 |
Timings @ Max Frequency (JEDEC) | 15-15-15-36 | 15-15-15-36 | 15-15-15-36 | 15-15-15-36 |
Maximum frequency (MHz) | 1067 | 1067 | 1067 | 1067 |
Maximum Transfer Speed (MT/s) | DDR4-2133 | DDR4-2133 | DDR4-2133 | DDR4-2133 |
Maximum Bandwidth (MB/s) | PC4-17000 | PC4-17000 | PC4-17000 | PC4-17000 |
Minimum Clock Cycle Time, tCK (ns) | 0.938 | 0.938 | 0.938 | 0.938 |
Minimum CAS Latency Time, tAA (ns) | 13.750 | 13.750 | 13.750 | 13.750 |
Minimum RAS to CAS Delay, tRCD (ns) | 13.750 | 13.750 | 13.750 | 13.750 |
Minimum Row Precharge Time, tRP (ns) | 13.750 | 13.750 | 13.750 | 13.750 |
Minimum Active to Precharge Time, tRAS (ns) | 33.000 | 33.000 | 33.000 | 33.000 |
Minimum Row Active to Row Active Delay, tRRD (ns) | 3.700 | 3.700 | 3.700 | 3.700 |
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 46.750 | 46.750 | 46.750 | 46.750 |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 350.000 | 350.000 | 350.000 | 350.000 |
| | | | |
DDR4 Specific SPD Attributes | | | | |
Maximum Clock Cycle Time, tCKmax (ns) | 1.600 | 1.600 | 1.600 | 1.600 |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns) | 260.000 | 260.000 | 260.000 | 260.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns) | 160.000 | 160.000 | 160.000 | 160.000 |
Minimum Activate to Activate Delay Time different bank group, tRRD_Smin (ns) | 3.700 | 3.700 | 3.700 | 3.700 |
Minimum Activate to Activate Delay Time same bank group, tRRD_Lmin (ns) | 5.300 | 5.300 | 5.300 | 5.300 |
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns) | 5.625 | 5.625 | 5.625 | 5.625 |
Minimum Four Activate Window Delay (ns) | 21.000 | 21.000 | 21.000 | 21.000 |
Maximum Activate Window in units of tREFI | 8192 | 8192 | 8192 | 8192 |
Thermal Sensor Present | No | No | No | No |
DRAM Stepping | 0.0 | 0.0 | 0.0 | 0.0 |
DRAM Manufacture | SK Hynix | SpecTek Incorporated | SpecTek Incorporated | SK Hynix |
SDRAM Package Type | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack |
Maximum Activate Count (MAC) | Unlimited MAC | Unlimited MAC | Unlimited MAC | Unlimited MAC |
Post Package Repair Supported | Yes | Yes | Yes | Yes |
Module Type | UDIMM | UDIMM | UDIMM | UDIMM |
Module Height (mm) | 32 | 32 | 32 | 32 |
Module Thickness (front), (mm) | 2 | 2 | 2 | 2 |
Module Thickness (back), (mm) | 2 | 2 | 2 | 2 |
Reference Raw Card Used | Raw Card A Rev. 18 | Raw Card A Rev. 18 | Raw Card A Rev. 18 | Raw Card A Rev. 18 |
| | | | |
XMP Attributes | | | | |
XMP Revision | 2.0 | 2.0 | 2.0 | 2.0 |
Enthusiast / Certified Profile | | | | |
Module voltage | 1.35V | 1.35V | 1.35V | 1.35V |
Clock speed (MHz) | 1802 | 1802 | 1802 | 1802 |
Transfer Speed (MT/s) | DDR4-3603 | DDR4-3603 | DDR4-3603 | DDR4-3603 |
Bandwidth (MB/s) | PC4-28800 | PC4-28800 | PC4-28800 | PC4-28800 |
Minimum clock cycle time, tCK (ns) | 0.555 | 0.555 | 0.555 | 0.555 |
Supported CAS latencies | 16 | 16 | 16 | 16 |
Minimum CAS latency time, tAA (ns) | 8.869 | 8.869 | 8.869 | 8.869 |
Minimum RAS to CAS delay time, tRCD (ns) | 10.454 | 10.454 | 10.454 | 10.454 |
Minimum row precharge time, tRP (ns) | 10.454 | 10.454 | 10.454 | 10.454 |
Minimum active to precharge time, tRAS (ns) | 21.625 | 21.625 | 21.625 | 21.625 |
Supported timing at highest clock speed | 16-19-19-39 | 16-19-19-39 | 16-19-19-39 | 16-19-19-39 |
Minimum Active to Auto-Refresh Delay, tRC (ns) | 32.059 | 32.059 | 32.059 | 32.059 |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC1 (ns) | 350.000 | 350.000 | 350.000 | 350.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns) | 260.000 | 260.000 | 260.000 | 260.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns) | 160.000 | 160.000 | 160.000 | 160.000 |
Minimum Four Activate Window Delay, tFAW (ns) | 24.000 | 24.000 | 24.000 | 24.000 |
Minimum Activate to Activate Delay Time different bank group, tRRD_S (ns) | 2.029 | 2.029 | 2.029 | 2.029 |
Minimum Activate to Activate Delay Time same bank group, tRRD_L (ns) | 4.849 | 4.849 | 4.849 | 4.849 |Grazie mille,
Saluti
